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New
JOD 15.00
- High performance thermal pad for efficient heat transfer
- 100x100x0.6mm dimension for various cooling applications
- High compressibility to adapt to uneven surfaces
- Soft and flexible structure for reliable contact
Description
- High-performance thermal pad designed for efficient heat transfer in cooling applications.
- Good thermal conductivity helps improve heat dissipation for components that require reliable thermal contact.
- Soft and flexible structure allows the pad to compensate for surface irregularities and maintain even heat distribution.
- High compressibility enables effective performance even under low contact pressure.
- 100x100x0.6mm dimension makes it suitable for custom cutting and a wide range of thermal management uses.
- Model: TG-MP8-100-100-05-1R.
- Item weight: 0.03 kg.
Specifications
Weight0.03 kg
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