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New
JOD 25.00
- High-performance thermal pad for efficient heat transfer
- 2.0mm thickness in XL size for larger applications
- 6 W/mK thermal conductivity for reliable cooling performance
- Non-electrically conductive for safe use near sensitive components
Description
- High-performance thermal pad designed to transfer heat away from microchips and into a heat sink for improved cooling efficiency.
- Versatile application for laptops, graphics cards, gaming consoles, and other electronic devices with heat-generating components.
- Efficient and durable material with 6 W/mK thermal conductivity for dependable thermal performance.
- Deformable contact surface helps fill cavities and gaps between components for precise contact and better heat dissipation.
- Non-electrically conductive design supports safer installation around sensitive circuits and printed circuit boards.
- XL size format with dimensions of 120 x 120 x 2.0 mm to suit larger cooling applications.
- Ideal replacement for aging or low-quality thermal pads to help restore cooling performance.
Specifications
Length120 cm
Width120 cm
Height2 cm
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